设备名称 Equipment Name

全自动硅片下料机  Automatic Wafer Unloader

设备型号 Equipment Model

DP-IV / LXP-IV

设备用途 Equipment Application

DP-IV：将上⼀道工序片篮中的硅片自动装入下⼀道工序片篮中。
DP-IV:Transfer wafers from the cassette of the previous process to the cassette of next process.

LXP-IV：将5道/8道/10道在线链式清洗设备中生产的硅片导入片篮。
LXP-IV:Unloading the wafers from the 5/8/10-lane inline cleaning equipment to cassettes. 

技术特点  Features

DP-IV

1、采用PLC控制，下片过程全自动完成；触摸屏菜单操作，简单明了。
With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

2、采用单道下片方式，保证下片生产率，同时满足硅片按批次⽣产的要求。
With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

3、采用双工位操作换片篮不停机。
Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

4、在线式/离线式可选。
Inline/Offline optional.

5、匹配AGV, RFID, MES 管理功能。
Compatible with AGV, RFID, MES function optional.
  
LXP-IV 

1、采用PLC控制，下片过程全自动完成；触摸屏菜单操作，简单明了。
With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

2、可对硅片进入下片机前进行破片检测和破片处理。（此功能需另外订购，标准机无此功能）
Breakage detection and treatment before wafer unload to the unloader. (need extra charges )

3、翻转功能，称重测试功能（此功能需另外订购，标准机无此功能）。
Wafer turnover function, Weight testing function (need extra charges)

4、匹配AGV,RFID,MES管理功能。
Compatible with AGV,RFID, MES management function.

设备参数  Parameters